ElectroScience - Thick-Film Materials & Ceramic TapesElectroScience - Thick-Film Materials & Ceramic Tapes

Applications

Medical

Product Purpose PDF Order Trial
Quantity
9912-G Silver Conductor
Excellent solderability and leach resistance, for use on alumina or beryllia
9512
Silver-Platinum Conductor
Excellent thermal cycle adhesion and solderability, low cost, for general use
9512-G Silver-Platinum Conductor
Excellent printability, for general use
9633-G Silver-Palladium Conductor
2/1, excellent leach and migration resistance
9635-HG Silver-Palladium Conductor
General purpose 6/1 for use on alumina and on dielectric, excellent solderability over ESL dielectrics
9635-H Silver-Palladium Conductor
6/1, excellent aged adhesion, Cd-free
9647 Silver-Palladium Conductor
3/1, excellent solderability and large Al wire bondability
9695 Silver-Palladium Conductor
20/1, wide firing range 625 - 930 °C
9562-F Silver-Palladium-Platinum Conductor
Resistor termination, large diameter wire bondability, low R, short firing cycle
9562-G Silver-Palladium-Platinum Conductor
Resistor termination, large diameter wire bondability, low R
8835-1A Gold Conductor
Alloyed gold for both Au and Al wire bonding
8835-1B Gold Conductor
General purpose, high adhesion, excellent line definition for Au wire bonding up to 33 µm
8844-G Gold Conductor
General purpose for use on alumina and 4920 dielectric, gives thin, smooth and dense films, excellent results with thermosonic gold wire bonding
8844 Gold Conductor
General purpose, Cd-free, fritless, 850 °C firing
8846-G Gold Conductor
General purpose, alloyed, for aluminum wire bonding use on alumina and 4920, gives thin, smooth and dense films, excellent results with thermosonic gold wire bonding
8881-B Gold Conductor
Etchable, fritless, 850 °C firing, thin printing (6 - 8 µm), dense film for 25 µm Au wire bonding
8884-G Gold Conductor
Excellent wire bonding and conductivity, fritless, 850 °C firing
5542 Platinum Conductor
Porous electrode material for use on partially stabilized zirconia
5544 Platinum Conductor
For use on resistance thermometers and heaters, TCR>3,300 ppm/°C
5545 Platinum Conductor
Excellent conductivity, for use on heating elements, etc.
5837-G Platinum-Gold Conductor
Solderable both on alumina and when printed and fired over 4917 dielectric, can also be used on beryllia
5837 Platinum-Gold Conductor
For use on alumina, solderable
5837-A Platinum-Gold Conductor
For use on multilayer dielectric, solderable
9912-THP Silver through hole
Through-hole applications in alumina substrates
8835 VF-G Gold Via Fill
For multilayers
R-300-A/B series Resistor Series
For resistors, two series, blendable in the resistivity ranges 1 - 10 kohm/sq. and 10 k - 1 Mohm/sq.
4905-C Multilayer Dielectric
Filled glass-ceramic, for use with gold conductors
4911 Multilayer Dielectric
Multilayer dielectric, for high-frequency, low-loss applications, k = 4
4917 Multilayer Dielectric
Multilayer dielectric, suitable for mixed metals, high BDV
4920 Multilayer Dielectric
Thin printing, suitable for mixed metals, high BDV
4612-B Overglaze & Crossover Dielectric
Alkali-free, crystallizing, green color
G-481 Overglaze
Acid resistant, excellent silver migration protection, green, 600 °C
G-482 Overglaze
Same as G-481, but black
4771-P2 Overglaze
Resistor overglaze, fires 525 - 625 °C
See also ESL Capacitor Dielectric Pastes and ESL Tape Systems

Green Products are Lead-Free, Cadmium-Free

The above ESL materials are representative of the most common market requirements. The front-side and back-side silvers are available in a number of versions, depending on factors such as the type of silicon (single crystal, poly- or multi-crystalline, etc.), the nature of the anti-reflective coating (silicon nitride, titanium dioxide, etc.) and the paste application method (screen printing, etc.)